SAC387 is a lead-free solder alloy made up of 95.5% tin, 3.8% silver, and 0.7% copper. It melts between 219-225°C and is RoHS-compliant, making it a practical replacement for traditional tin-lead solders. It's widely used in SMT, wave soldering, and selective soldering on PCBs, as well as BGA and CSP semiconductor packaging. Strong mechanical properties, good thermal fatigue resistance, and smooth wetting characteristics make it a reliable choice for automotive, aerospace, medical, and consumer electronics applications.
Features:
- Excellent Solder Joint Reliability - Strong mechanical properties ensure durable, long-lasting connections.
- Good Thermal Fatigue Resistance – Performs well under repeated heating and cooling cycles, reducing joint failure risks.
- Smooth Wetting & Flow Properties – Provides consistent and high-quality soldering results with good adhesion.
- Versatile Applications – Used in various industries, including consumer electronics, automotive, aerospace, and medical devices.
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SAC387 Solid 1/32" x 1 lb spool
$104.00
SAC387 Solid solder in 1/32" (.031") diameter on a 1 lb. Spool. 423-424°F/217-218°C Melting temperature
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SAC387 - 1lb. Regular Bar
$79.00
SAC387 Solid solder in a nominal 1 lb. Regular Bar. 423-424°F/217-218°C Melting temperature
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SAC387 - 5lb. Notch Bar
$380.00
SAC387 Solid solder in a nominal 5 lb. Notch Bar. 423-424°F/217-218°C Melting temperature
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SAC387 Solid 3/32" x 1/2 lb spool
$58.00
SAC387 Solid solder in 3/32" (.093") diameter on a 1/2 lb. Spool. 423-424°F/217-218°C Melting temperature
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SAC387 Solid 3/32" x 1 lb spool
$91.00
SAC387 Solid solder in 3/32" (.093") diameter on a 1 lb. Spool. 423-424°F/217-218°C Melting temperature
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SAC387 Solid 1/32" x 1/2 lb spool
$71.00
SAC387 Solid solder in 1/32" (.031") diameter on a 1/2 lb. Spool. 423-424°F/217-218°C Melting temperature
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SAC387 Solid 1/16" x 1/2 lb spool
$58.00
SAC387 Solid solder in 1/16" (.062") diameter on a 1/2 lb. Spool. 423-424°F/217-218°C Melting temperature
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SAC387 Solid 1/16" x 1 lb spool
$91.00
SAC387 Solid solder in 1/16" (.062") diameter on a 1 lb. Spool. 423-424°F/217-218°C Melting temperature
SAC387 Technical Data:
| Characteristic | Value |
|---|---|
| Composition | 95.50% Tin (Sn), 3.80% Silver (Ag), 0.70% Copper (Cu) |
| Melting Range | 219-225°C (426-437°F) |
| Density | 7.40 g/cm³ |
| Thermal Expansion Coefficient | 21.5 μm/m°C |
| Tensile Strength | 7,510 PSI |
| Applications | Used in electronic assembly, wave soldering, selective soldering, and industrial electronics |
| Advantages | Excellent solder joint reliability, good wetting properties, lead-free compliance |
| RoHS Compliance | Yes, lead-free |
| Environmental Impact | Lead-free, reduced toxicity compared to leaded solders |
| Availability | Available in bar and wire form |
| Recommended Solder Pot Temperature | 260-320°C (500-608°F) |