SAC405 is a lead-free solder alloy made up of 95.5% tin, 4% silver, and 0.5% copper, with a melting point of 217-219°C (423-426°F). It's a go-to choice for reflow soldering, wave soldering, and BGA/CSP packaging thanks to its high ductility and thermal fatigue resistance. The elevated silver content improves corrosion resistance and oxidation protection. NSF-compliant for potable water systems, it also works well for hand soldering, rework, and precision prototyping in solid-core wire and bar form.
Features:
- Low melting point of approximately 217-219°C (423-426°F)
- Reliable joints with high termal cycling resistance.
- Excellent Wetting Properties, ideal for fine-pitch components and Ball Grid Array (BGA) soldering.
- The higher silver content improves resistance to oxidation and environmental degradation.
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SAC405 - 5 lb. Notch Bar
$380.00
SAC405 Solid solder in a nominal 5 lb. Notch Bar. 423-426°F/217-219°C Melting temperature
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SAC405 - 1 lb. Regular Bar
$79.00
SAC405 Solid solder in a nominal 1 lb. Regular Bar. 423-426°F/217-219°C Melting temperature
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SAC405 Solid 3/32" x 1 lb spool
$91.00
SAC405 Solid solder in 3/32" (.093") diameter on a 1 lb. Spool. 423-426°F/217-219°C Melting temperature
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SAC405 Solid 3/32" x 1/2 lb spool
$58.00
SAC405 Solid solder in 3/32" (.093") diameter on a 1/2 lb. Spool. 423-426°F/217-219°C Melting temperature
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SAC405 Solid 1/32" x 1/2 lb spool
$71.00
SAC405 Solid solder in 1/32" (.031") diameter on a 1/2 lb. Spool. 423-426°F/217-219°C Melting temperature
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SAC405 Solid 1/32" x 1 lb spool
$104.00
SAC405 Solid solder in 1/32" (.031") diameter on a 1 lb. Spool. 423-426°F/217-219°C Melting temperature
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SAC405 Solid 1/16" x 1/2 lb spool
$58.00
SAC405 Solid solder in 1/16" (.062") diameter on a 1/2 lb. Spool. 423-426°F/217-219°C Melting temperature
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SAC405 Solid 1/16" x 1 lb spool
$91.00
SAC405 Solid solder in 1/16" (.062") diameter on a 1 lb. Spool. 423-426°F/217-219°C Melting temperature
SAC405 Technical Data:
| Composition | 95.5% Sn, 4.0% Ag, 0.5% Cu |
| Melting Range | 217-219°C (423-426°F) |
| Density | ~7.37 g/cm³ |
| Thermal Expansion Coefficient | ~22.5 × 10⁻⁶ /°C |
| Thermal Conductivity | ~32 W/m·K |
| Specific Heat Capacity | ~0.21 J/g·K |
| Hardness (HV) | ~15-20 HV |
| Tensile Strength | 7,540 PSI |
| Applications | Aerospace, Medical, SMT, BGA |
| Advantages | High reliability, good wetting, low oxidation |
| RoHS Compliance | Yes |
| Environmental Impact | Lead-free, eco-friendly |
| Availability | Widely available in solder wire and bar forms |
| Recommended Solder Pot Temp | ~260-280°C (500-536°F) |