SAC305 is a lead-free solder alloy made up of 96.5% tin, 3% silver, and 0.5% copper — the industry-standard RoHS-compliant replacement for traditional lead-based solders. With a narrow melting range of 217–219°C, it works across hand soldering, wave soldering, and SMT applications. Its manufacturing process minimizes suspended oxides to reduce dross generation, and it delivers strong mechanical bonds with excellent thermal fatigue resistance for reliable electronic assemblies.
Features:
- Low melting melting range of approximately 217–219°C (423–426°F).
- Provides strong and reliable solder joints, making it suitable for electronic assemblies.
- Complies with RoHS and other lead-free standards, making it environmentally friendly.
- Its manufacturing process minimizes suspended oxides, reducing dross generation during soldering.
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SAC305 Solid 3/32" x 1 lb spool
$91.00
SAC305 Solid solder in 3/32" (.093") diameter on a 1 lb. Spool. 423-428°F/217-220°C Melting temperature
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SAC305 - 1lb. Regular Bar
$79.00
SAC305 Solid solder in a nominal 1 lb. Regular Bar. 423-428°F/217-220°C Melting temperature
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SAC305 Solid 1/16" x 1 lb spool
$91.00
SAC305 Solid solder in 1/16" (.062") diameter on a 1 lb. Spool. 423-428°F/217-220°C Melting temperature
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SAC305 Solid 1/32" x 1/2 lb spool
$71.00
SAC305 Solid solder in 1/32" (.031") diameter on a 1/2 lb. Spool. 423-428°F/217-220°C Melting temperature
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SAC305 Solid 1/32" x 1 lb spool
$104.00
SAC305 Solid solder in 1/32" (.031") diameter on a 1 lb. Spool. 423-428°F/217-220°C Melting temperature
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SAC305 - 5lb. Notch Bar
$380.00
SAC305 Solid solder in a nominal 5 lb. Notch Bar. 423-428°F/217-220°C Melting temperature
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SAC305 Solid 3/32" x 1/2 lb spool
$58.00
SAC305 Solid solder in 3/32" (.093") diameter on a 1/2 lb. Spool. 423-428°F/217-220°C Melting temperature
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SAC305 Solid 1/16" x 1/2 lb spool
$58.00
SAC305 Solid solder in 1/16" (.062") diameter on a 1/2 lb. Spool. 423-428°F/217-220°C Melting temperature
SAC305 Technical Data
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Composition |
Tin (96.5%), Silver (3%), Copper (0.5%) |
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Melting Range |
Solidus: 217°C (423°F), Liquidus: 220°C (428°F) |
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Density |
7.37 g/cm³ |
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Thermal Expansion Coefficient |
21.9 µm/m/°C (20°C to 100°C) |
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Thermal Conductivity |
58.7 W/(m·K) |
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Specific Heat Capacity |
0.232 J/g·K |
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Hardness |
14.1 HV |
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Tensile Strength |
42 MPa |
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Applications |
Wave soldering, selective soldering, SMT reflow processes |
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Advantages |
- Excellent wetting speed |
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- Reduced dross generation |
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- Superior solder joint reliability |
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- Strong mechanical properties |
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Flux Compatibility |
Compatible with no-clean and water-soluble fluxes |
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RoHS Compliance |
Meets the European Union's RoHS directive for lead-free soldering |
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Safety Notes |
- Requires proper ventilation |
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- Use protective gear when working with this material |
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Environmental Impact |
Lead-free composition reduces environmental hazards |
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Availability |
Available in solder wire and solder bar |
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Recommended Solder Pot Temperature |
255–265°C for wave soldering, 280–320°C for selective soldering |