{"product_id":"sac405-solid-3-32-x-1-2-lb-spool","title":"SAC405 Solid 3\/32\" x 1\/2 lb spool","description":"\u003cp\u003eKapp Alloy's SAC405 solid solder comes in a 3\/32\" (2.4mm) diameter, 1\/2 lb spool with a 95.5% Sn\/ 4% Ag\/ 0.4% Cu composition. It's NSF compliant, lead-free, and cadmium-free, making it safe for potable water applications. With a low melt point of 423°F \/ 217°C, it creates strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi. It's also widely used in electronics for reflow, wave, hand, and BGA soldering applications.\u003c\/p\u003e\u003cp\u003eUsed in the electronics industry through the following techniques:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eReflow Soldering\u003c\/strong\u003e – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWave Soldering\u003c\/strong\u003e – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHand Soldering\u003c\/strong\u003e – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBall Grid Array (BGA) Soldering\u003c\/strong\u003e – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Kapp Alloy","offers":[{"title":"Default Title","offer_id":45425027088407,"sku":"281-09302","price":58.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0809\/8686\/5687\/files\/281_09302_top.jpg?v=1787581777","url":"https:\/\/kappalloy.com\/products\/sac405-solid-3-32-x-1-2-lb-spool","provider":"Kapp Alloy","version":"1.0","type":"link"}