{"title":"SAC405","description":"","products":[{"product_id":"sac405-solid-1-16-x-1-lb-spool","title":"SAC405 Solid 1\/16\" x 1 lb spool","description":"\u003cp\u003eSAC405 solid solder wire in 1\/16\" (1.6mm) diameter comes on a 1 lb spool, made from 95.5% tin, 4% silver, and 0.4% copper. It's lead-free, cadmium-free, and NSF compliant for potable water applications, melting at 423°F \/ 217°C. It produces strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi and good resistance to vibration and stress. Suitable for reflow, wave, hand soldering, and BGA applications in electronics manufacturing and repair.\u003c\/p\u003e\u003cp\u003eUsed in the electronics industry through the following techniques:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eReflow Soldering\u003c\/strong\u003e – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWave Soldering\u003c\/strong\u003e – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHand Soldering\u003c\/strong\u003e – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBall Grid Array (BGA) Soldering\u003c\/strong\u003e – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Kapp Alloy","offers":[{"title":"Default Title","offer_id":45425026957335,"sku":"281-06201","price":91.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0809\/8686\/5687\/files\/281_06201_top.jpg?v=1787581765"},{"product_id":"sac405-solid-1-16-x-1-2-lb-spool","title":"SAC405 Solid 1\/16\" x 1\/2 lb spool","description":"\u003cp\u003eKapp Alloy's SAC405 solid solder comes in a 1\/16\" (1.6mm) diameter, 1\/2 lb spool with a 95.5% Sn\/ 4% Ag\/ 0.4% Cu composition. It's NSF compliant, lead-free, and cadmium-free, making it safe for potable water applications. With a low melt point of 423°F \/ 217°C, it produces strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi. It's also widely used in electronics for reflow, wave, hand, and BGA soldering applications.\u003c\/p\u003e\u003cp\u003eUsed in the electronics industry through the following techniques:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eReflow Soldering\u003c\/strong\u003e – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWave Soldering\u003c\/strong\u003e – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHand Soldering\u003c\/strong\u003e – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBall Grid Array (BGA) Soldering\u003c\/strong\u003e – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Kapp Alloy","offers":[{"title":"Default Title","offer_id":45425026990103,"sku":"281-06202","price":58.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0809\/8686\/5687\/files\/281_06202_top.jpg?v=1787581768"},{"product_id":"sac405-solid-1-32-x-1-lb-spool","title":"SAC405 Solid 1\/32\" x 1 lb spool","description":"\u003cp\u003eSAC405 solder in a 1\/32\" (0.8mm) solid wire, 1 lb spool is a lead-free, cadmium-free alloy made from 95.5% tin, 4% silver, and 0.4% copper. NSF compliant and potable water safe, it melts at 423°F \/ 217°C, making it a practical choice for copper, brass, and stainless steel applications. It delivers tensile strengths up to 7,540 psi with strong resistance to vibration and stress. Commonly used in reflow, wave, hand, and BGA soldering across electronics manufacturing and repair.\u003c\/p\u003e\u003cp\u003eUsed in the electronics industry through the following techniques:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eReflow Soldering\u003c\/strong\u003e – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWave Soldering\u003c\/strong\u003e – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHand Soldering\u003c\/strong\u003e – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBall Grid Array (BGA) Soldering\u003c\/strong\u003e – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Kapp Alloy","offers":[{"title":"Default Title","offer_id":45425027022871,"sku":"281-03101","price":104.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0809\/8686\/5687\/files\/281_03101_top.jpg?v=1787581771"},{"product_id":"sac405-solid-1-32-x-1-2-lb-spool","title":"SAC405 Solid 1\/32\" x 1\/2 lb spool","description":"\u003cp\u003eSAC405 solid solder wire in 1\/32\" (0.8mm) diameter comes on a convenient 1\/2 lb spool, made with a 95.5% Sn\/ 4% Ag\/ 0.4% Cu alloy. It's NSF compliant, lead-free, and cadmium-free, making it potable water safe. With a low melt point of 423°F \/ 217°C, it forms strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi. Suitable for reflow, wave, hand soldering, and BGA applications in electronics manufacturing and repair.\u003c\/p\u003e","brand":"Kapp Alloy","offers":[{"title":"Default Title","offer_id":45425027055639,"sku":"281-03102","price":71.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0809\/8686\/5687\/files\/281_03102_top.jpg?v=1787581774"},{"product_id":"sac405-solid-3-32-x-1-2-lb-spool","title":"SAC405 Solid 3\/32\" x 1\/2 lb spool","description":"\u003cp\u003eKapp Alloy's SAC405 solid solder comes in a 3\/32\" (2.4mm) diameter, 1\/2 lb spool with a 95.5% Sn\/ 4% Ag\/ 0.4% Cu composition. It's NSF compliant, lead-free, and cadmium-free, making it safe for potable water applications. With a low melt point of 423°F \/ 217°C, it creates strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi. It's also widely used in electronics for reflow, wave, hand, and BGA soldering applications.\u003c\/p\u003e\u003cp\u003eUsed in the electronics industry through the following techniques:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eReflow Soldering\u003c\/strong\u003e – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWave Soldering\u003c\/strong\u003e – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHand Soldering\u003c\/strong\u003e – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBall Grid Array (BGA) Soldering\u003c\/strong\u003e – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Kapp Alloy","offers":[{"title":"Default Title","offer_id":45425027088407,"sku":"281-09302","price":58.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0809\/8686\/5687\/files\/281_09302_top.jpg?v=1787581777"},{"product_id":"sac405-solid-3-32-x-1-lb-spool","title":"SAC405 Solid 3\/32\" x 1 lb spool","description":"\u003cp\u003eSAC405 solid solder in 3\/32\" (2.4mm) diameter comes on a 1 lb spool, made from 95.5% tin, 4% silver, and 0.4% copper. It's lead-free, cadmium-free, and NSF compliant for potable water applications, melting at 423°F \/ 217°C. It forms strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi and good resistance to vibration and stress. Suitable for reflow, wave, hand soldering, and BGA applications in electronics manufacturing.\u003c\/p\u003e\u003cp\u003eUsed in the electronics industry through the following techniques:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eReflow Soldering\u003c\/strong\u003e – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWave Soldering\u003c\/strong\u003e – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHand Soldering\u003c\/strong\u003e – Suitable for repair and prototyping, requiring precise temperature control to prevent oxidation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBall Grid Array (BGA) Soldering\u003c\/strong\u003e – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Kapp Alloy","offers":[{"title":"Default Title","offer_id":45425027121175,"sku":"281-09301","price":91.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0809\/8686\/5687\/files\/281_09301_top.jpg?v=1787581780"},{"product_id":"sac405-1-lb-regular-bar","title":"SAC405 - 1 lb. Regular Bar","description":"\u003cp\u003eSAC405 solder in a nominal 1 lb regular bar format, made with 95.5% tin, 4% silver, and 0.4% copper. This lead-free, cadmium-free alloy melts at 423°F (217°C) and meets NSF compliance for potable water applications. It forms strong, ductile joints on copper, brass, and stainless steel with tensile strengths up to 7,540 psi and solid resistance to vibration and stress. Also widely used in electronics for reflow soldering, wave soldering, and BGA applications.\u003c\/p\u003e\u003cp\u003eUsed in the elctronics industry through the following techniques:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eReflow Soldering\u003c\/strong\u003e – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWave Soldering\u003c\/strong\u003e – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBall Grid Array (BGA) Soldering\u003c\/strong\u003e – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Kapp Alloy","offers":[{"title":"Default Title","offer_id":45425027153943,"sku":"281-91001","price":79.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0809\/8686\/5687\/files\/1lb_bar_r2_14.jpg?v=1787581783"},{"product_id":"sac405-5-lb-notch-bar","title":"SAC405 - 5 lb. Notch Bar","description":"\u003cp\u003eKapp Alloy's SAC405 nominal 5 lb notch bar is a lead-free, cadmium-free solder made from 95.5% tin, 4% silver, and 0.4% copper. NSF compliant and potable water safe, it melts at 423°F \/ 217°C, making it a reliable choice for copper, brass, and stainless steel applications. With tensile strengths up to 7,540 psi and high tolerance to vibration and stress, it's also widely used in electronics for reflow soldering, wave soldering, and BGA applications.\u003c\/p\u003e\u003cp\u003eUsed in the electronics industry through the following techniques:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eReflow Soldering\u003c\/strong\u003e – Common in surface mount technology (SMT), SAC405 is heated to its melting point using a controlled temperature profile.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWave Soldering\u003c\/strong\u003e – Used for through-hole components, where the solder is applied in a wave-like motion to create strong joints.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBall Grid Array (BGA) Soldering\u003c\/strong\u003e – SAC405 is often used in BGA and chip-scale package (CSP) applications, ensuring reliable connections.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Kapp Alloy","offers":[{"title":"Default Title","offer_id":45425027219479,"sku":"281-93006","price":380.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0809\/8686\/5687\/files\/5lb_bar_13.jpg?v=1787581785"}],"url":"https:\/\/kappalloy.com\/collections\/sac405.oembed","provider":"Kapp Alloy","version":"1.0","type":"link"}