KappZapp™ - Silver Solders for Stainless Steel to Stainless Steel and Copper
KappZapp™ solders produce strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 33,000 psi on Stainless. KappZapp7™ - 93% Tin - 7% Silver is the best Stainless-to-Copper solder available, with high conductivity, ductility and strength.
Kapp Comet™ Flux is designed specifically to remove the difficult oxide layer on Stainless Steel to allow a strong metallic bond on soldering Stainless Steel and Copper.
KappZapp™ Acid-cored Solders are used in structural applications on Stainless Steel and Copper.
KappFree™ Acid-cored Solder is used in potable water applications on Stainless Steel and Copper
Benefits and Uses
Low melting temperatures prevent loss of properties and minimize distortion on thin wires and sheets. KappZapp™ Tin-Silver alloys are used for electronics, fabrication, ducting, food containers, storage bins, instruments, Copper plumbing pipe, and cooling coils for refrigerators. In many instances, a stronger overall assembly exists after joining with KappZapp™ Tin-Silver solder than with higher temperature Silver brazing alloys.
The most popular of the low temperature Silver bearing solders are KappZapp3.5™ -96.5% Tin, 3.5% Silver and KappZapp4™ - 96% Tin, 4% Silver. The KappZapp4™ - 4% Silver formula is often preferred for hand soldering Stainless and Copper parts. It has a wider slushy or plastic range to allow users to manipulate parts during cooling.
Kapp Alloy also produces Tin-Silver solders with up to 7% Silver for applications requiring a higher temperature range and/or higher Silver content for superior strength and vibration resistance.
The following chart represents Kapp Alloy’s standard Tin-Silver alloys. Many factors, such as materials, temperature, and method of application determine the solder joint strength and characteristics. Call Kapp for engineering assistance to discuss your specific needs. We recommend testing appropriate alloys in your specific application to ensure suitability. Samples of Kapp alloys are always available upon request.
|Sn||Zn||Pb||Cd||Ag||Cu||Sb||C°||F°||RFQ||Wire||Ribbon||1/8"x18"||Handy Vials||Acid Core||Rosin Core|
|Sn=Tin, Zn=Zinc, Pb=Lead, Cd=Cadmium, Ag=Silver, Cu=Copper, Sb=Antimony|
|Physical Properties & Technical Data|
|Composition||96.5Sn - 3.5Ag||96Sn - 4Ag||95Sn - 5Ag||94Sn - 6Ag||93Sn - 7Ag|
|Solidus(°F) /(°C)||430°F / 221°C||430°F / 221°C||430°F / 221°C||430°F / 221°C||430°F / 221°C|
|Liquidus(°F) /(°C)||430°F / 221°C||475°F / 246°C||490°F / 254°C||535°F / 279°C||570°F / 299°C|
|Tensile Strength (copper)||14,000 psi||14,000 psi||15,000 psi||15,000 psi||15,500 psi|
|Tensile Strength (stainless)||25,000 psi||28,000 psi||29,000 psi||30,000 psi||31,000 psi|
|Shear Strength||11,600 psi||12,000 psi||13,000 psi||13,500 psi||14,000 psi|
|Electrical Conductivity (%IACS)||16.4||16.5||16.6||17.1||20.1|
All KappZapp™ solid solders are available in bar or wire form. Custom alloys and forms are our specialty.
KappZapp3.5A™ Acid-cored Solder is used in structural applications on Stainless Steel and Copper. This is the same eutectic formulation as KappZapp3.5, but with a 3% Acid core. The flux residue can be removed with warm water or alcohol and a clean rag.
KappFreeA™ Acid-cored Tin-Copper-Silver Solder is used in potable water systems for Stainless Steel to Stainless Steel and Copper. This solder meets ASTM and NSF requirements for Lead-free potable water system soldering. The flux residue can be removed with warm water and a clean rag or simply by flushing with water.