Kapp Electric Eutectic™ - Tin-Lead-Silver Solder for Electronics

With a composition of 62% Tin / 36% Lead / 2% Silver, Kapp Electric Eutectic™ is a cost effective eutectic electrical/electronic solder where Lead is permissible. Silver increases the strength and vibration resistance of the joint in higher stress applications. Specification: ASTM B32, Grade Sn62, QQS571.

Benefits and Uses

Kapp Electric Eutectic™ melts and solidifies at 354°F / 179°C. Its lower application temperature uses less energy and requires less time and post-production cleanup, often requiring only inspection. It also eliminates the effects of high heat used in higher temperature brazing avoiding electronic material degradation, base metal deformation, discoloration, segregation, annealment, and heat related oxide-scale formation, just to name a few.

Kapp Electric Eutectic™ is available in both solid wire and as a Rosin-cored solder for extremely fast electrical/electronic soldering. Kapp Electric EutecticRC™ contains a natural mild rosin core for use on delicate electronic joints. The flux residue can be removed with warm water and a clean rag.

The following chart contains typical physical properties for Kapp Electric Eutectic™ solder joints. Many factors, such as materials, temperature, and method of application determine the solder joint strength and characteristics. Call Kapp for engineering assistance to discuss your specific needs. We recommend testing appropriate alloys in your specific application to ensure suitability. Samples of Kapp alloys are always available upon request.

Physical Properties & Technical Data
Composition 62Sn/36Pb/2Ag
Solidus (°F)/(°C) 354°F / 179°C Eutectic
Liquidus(°F)//(°C) 354°F / 179°C
Tensile Strength 21,00psi*
Shear Strength 10,000 psi*
Elongation 2%
Electrical Conductivity 12.2 (%IACS)