Kapp Copper-Bond Flux™ - Soldering Flux for Non-Aluminum
550°F- 800°F (288°C - 427°C)

Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredients.

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Benefits and Uses

Excellent for use with KappTec™ - 95% Cadmium - 5% Silver, KappZapp7™ - 93% Tin - 7% Silver and most solders with temperature requirements above 550°F applied to metals other than Aluminum. Good wetting properties.

Effective soldering range - 550°F - 800°F (288°C - 427°C).

Residue is corrosive, easily removed with warm water rinse or a clean wet rag.

The following chart represents the physical properties of Kapp Copper-Bond Flux™. Many factors, such as materials, temperature, and method of application determine the most effective flux. Call Kapp for engineering assistance to discuss your specific needs. We recommend testing appropriate fluxes in your specific application to ensure suitability. Samples of Kapp fluxes are always available upon request.

Physical Properties & Technical Data
Fluxing Range 550F TO 800°F (288°C - 427°C)
Specific Gravity 1.532 @ 78°F
Appearance Reddish clear liquid, no characteristic odor
Solubility Soluble in water
pH Slightly Alkaline
Corrosivity mildly corrosive to steel and soldered joints
Weight Per Gallon 12.7
Shelf Life 1 Year unopened at ambient temp
Packaging Convenient 2 oz. and 6 oz. dispenser bottles,& 1/2 gallon & 1 gallon bulk bottles

*Please Note: Flux is rated by D.O.T. As Corrosive Hazard - Can Not Be Shipped By Air